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Intertek discusses food packaging issues at World Congress of Food 2014

Boca Raton, USA - Intertek (www.intertek.com), a leading provider of quality and safety services to a wide range of industries, is pleased to announce its participation at the 3rd Annual World Congress of Food, which will be held during August 29-31, 2014, Changchun, China.

The food packaging industry demands convenience, innovation, design and sustainability. Packaging must keep the products fresh and free from contamination whilst complying with the latest regulations. Food producers are required to ensure that there are no materials in the packaging that are potentially harmful to human health, including chemical substance migration from the food contact material to the food.

Intertek expert Naeem Mady, Vice President of Regulatory Affairs will be delivering two presentations at the upcoming World Congress of Food 2014, held in Changchun. The first will focus on the importance of packaging to the food industry, followed up by a discussion on the global regulations for packaging to help companies improve their understanding of their product safety requirements.

"Food packaging companies find it incredibly challenging to keep up with the growing number and complex nature of packaging regulations and safety requirements that are in force or in development around the world” says, regulatory expert, Naeem Mady.  “I am honoured to participate with fellow food specialists to discuss the solutions to the current development problems within food packaging.”

To learn more about the food contact services offered by our scientific and regulatory consultants and from the larger Intertek organization, please visit http://www.intertek.com/food/contact/.

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